Classification le khetho ea tloaelehileng PCB poleiti FR4

EA-4

Leqephe la FR-4 , e 'ngoe ea li-substrate tse sebelisoang haholo, ke nomoro ea khoutu ea thepa e hanelang mollo, e bolelang tlhaloso ea thepa eo thepa ea resin e lokelang ho khona ho e tima ka boyona. FR-4 ha se lebitso la thepa, empa ke boemo ba thepa.

  FR-4 hangata e arotsoe ka:

  FR-4 poleiti e thata, botenya bo tloaelehileng ba 0.8-3.2mm;

  FR-4 poleiti e tšesaane, botenya bo tloaelehileng bo ka tlase ho 0.78 mm.

  Matšoao a akaretsang a mahlale a maqephe a FR-4 ke: matla a ho kobeha, matla a peel, ts'ebetso ea ts'ebetso ea mocheso, ts'ebetso e thibelang lelakabe, coefficient ea ho hanyetsa molumo, ho hanyetsa holimo, dielectric constant, dielectric loss angle, khalase ea phetoho ea mocheso Tg, botsitso ba dimensional Ho sebelisa mocheso, warpage. , joalo-joalo.

Katoloso ea tsebo: Phapang ea lisebelisoa tsa PCB

1, substrate ea lesela la khalase: FR-4, FR-5

  Sengoloa se hatelletsoeng ka sebopeho sa poleiti se entsoeng ke electronclock e inehetseng ka har'a epoxy phenolic epoxy resin e fetisoa ka mocheso o phahameng, khatello e phahameng le mochine oa khatiso o chesang.

  Lesela la fiber ea khalase ea epoxy (eo hangata e tsejoang e le: poleiti ea epoxide, fiberboard ea khalase, fiberboard, FR4). The epoxy glass fiber non-substrate ke sehlopha sa substrates bakeng sa lisebelisoa tse matlafatsang ka epoxy resin.

  Epoxy glass fiber e koahetsoeng ka matla a poleiti ea koporo, ho hanyetsa mocheso o motle, dielectric tse ntle, substrate ka masoba e ka etsoa metallized, hlokomela conduction ea potoloho pakeng tsa multilayer e hatisitsoeng ka mahlakoreng a mabeli le interlayer, khalase ea epoxy e koahetsoeng ka poleiti ea koporo Ke sehlopha sa tšebeliso e molemo ka ho fetisisa boleng bohle ba koporo.

2, karoloana ea pampiri: FR-1, FR-2, FR-3, joalo-joalo.

  The phenolic paper substrate ke phenolic resin e le sekhomaretsi ho matlafatsa thepa e le lera la bokaholimo.

3, substrate e kopantsoeng: CEM-1 le CEM-3

  Li-substrates tse joalo haholo-holo ke lipoleiti tsa koporo tse koahetsoeng ka CEM, tseo CEM-1 (epoxy paper-based cores) le CEM-3 (epoxy glass nonwoven core) ke mefuta e 'meli ea bohlokoa ho CEM. Letlapa la letoto la CEM le na le ts'ebetso e ntle ea ho sebetsa, ho batalla, botsitso ba sebopeho, ho nepahala ha botenya, matla a eona a mochini, ts'ebetso ea dielectric, motsamao oa tšepe, joalo-joalo, e phahame ho feta karolo ea pampiri, athe matla a mochini (CEM-3) A 80% ea FR-4. , theko e tlase ho feta boto ea FR-4.

4, substrate e khethehileng ea thepa (ceramic, tšepe, joalo-joalo)